Zvinotsanangurwa | |
Attribute | Value |
Mugadziri: | Winbond |
Product Category: | NOR Flash |
RoHS: | Details |
Mounting Style: | SMD/SMT |
Pakeji / Nyaya: | SOIC-8 |
Series: | W25Q64JV |
Memory size: | 64 Mbit |
Supply Voltage - Min: | 2.7 V |
Supply Voltage - Max: | 3.6 V |
Active Read Current - Max: | 25 mA |
Rudzi rweInterface: | SPI |
Maximum Clock Frequency: | 133 MHz |
Sangano: | 8M x 8 |
Data Bus Width: | 8 zvishoma |
Mhando Yenguva: | Synchronous |
Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 85 C |
Kurongedza: | Tray |
Brand: | Winbond |
Supply Current - Max: | 25 mA |
Inonzwa Kunyorova: | Ehe |
Product Type: | NOR Flash |
Factory Pack Quantity: | 630 |
Subcategory: | Memory & Data Kuchengeta |
Tradename: | SpiFlash |
Unit Weight: | 0.006349 oz |
Features:
* Mhuri Itsva yeSpiFlash Memories - W25Q64JV: 64M-bit / 8M-byte
- Yakajairwa SPI: CLK, /CS, DI, ITA
- Dual SPI: CLK, / CS, IO0, IO1
- Quad SPI: CLK, / CS, IO0, IO1, IO2, IO3 - Software & Hardware Reset (1)
* Yepamusoro Kuita seri Flash
- 133MHz Imwe, Dual / Quad SPI wachi
266/532MHz yakaenzana Dual/Quad SPI
– Min.100K Chirongwa-Dzima matenderedzwa pachikamu - Kupfuura makore makumi maviri ekuchengetedza data
* Inoshanda "Kuramba Uchiverenga"
- Ramba uchiverenga ne8/16/32/64-Byte Kuputira - Mashoma se8 wachi kugadzirisa ndangariro
- Inobvumira yechokwadi XIP (ita munzvimbo) mashandiro - Outperforms X16 Parallel Flash
* Low Power, Wide Temperature Range - Single 2.7 kusvika 3.6V kupa
- <1μA Simba-pasi (typ.)
-40°C kusvika +85°C kushanda siyana
* Flexible Architecture ine 4KB zvikamu
-Uniform Sector/Block Erase (4K/32K/64K-Byte) - Chirongwa 1 kusvika 256 byte pane peji inorongwa
* Yepamberi Chengetedzo Zvimiro
-Software uye Hardware Nyora-Chengetedza
-Kudzivirirwa kwakakosha kweOTP (1)
-Pamusoro / Pazasi, Inozadzisa array dziviriro - Yega Block / Sector array kuchengetedza
- 64-Bit Yakasarudzika ID yechishandiso chimwe nechimwe
-Discoverable Parameters (SFDP) Rejista - 3X256-Bytes Chengetedza Rejista
-Kusagadzikana uye kusinga shanduke Status Register Bits
* Space Inoshanda Packaging
– 8-pini SOIC 208-mil / VSOP 208-mil
– 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-pini SOIC 300-mil
– 8-pini PDIP 300-mil
- 24-bhora TFBGA 8x6-mm (6x4 bhora array)
- 24-bhora TFBGA 8x6-mm (6x4/5x5 bhora array)
-Bata Winbond yeKGD uye dzimwe sarudzo