PCB pamusoro kurapwa ndiyo kiyi uye hwaro hweSMT chigamba mhando.Nzira yekurapa yekubatanidza iyi inonyanya kusanganisira pfungwa dzinotevera.Nhasi, ini ndichagovera chiitiko muhunyanzvi wedunhu bhodhi proofing newe:
(1) Kunze kweENG, ukobvu hweiyo plating layer haina kunyatso kutsanangurwa mune yakakodzera nyika zviyero zvePC.Inongodiwa chete kusangana nezvinodiwa solderability.Izvo zvinodikanwa zveindasitiri ndezvizvi.
OSP: 0.15 ~ 0.5 μm, isina kutaurwa neIPC.Inokurudzirwa kushandisa 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05～0.20um (PC inongotaura izvo zvino zvakaonda zvakanyanya zvinodiwa)
Im-Ag: 0.05 ~ 0.20um, iyo yakakora, iyo yakanyanya kuomarara iyo corrosion iri (PC haina kutaurwa)
Im-Sn: ≥0.08um.Chikonzero chekukora ndechekuti Sn neCu zvicharamba zvichikura kuita CuSn pakamuri tembiricha, izvo zvinokanganisa solderability.
HASL Sn63Pb37 inowanzo umbwa pakati pe1 ne25um.Zvakaoma kunyatso kudzora maitiro.Lead-isina inonyanya kushandisa SnCu alloy.Nekuda kwekushisa kwakanyanya kwekugadzirisa, zviri nyore kuumba Cu3Sn isina ruzha solderability, uye haisati yashandiswa parizvino.
(2) Kunyorova kuSAC387 (maererano nenguva yekunyorova pasi penguva dzakasiyana dzekupisa, unit: s).
0 nguva: im-sn (2) florida kuchembera (1.2), osp (1.2) im-ag (3).
Zweiter PLENAR CHIKAMU Zweiter PLENAR SESSION Im-Sn ine yakanyanya kunaka kusaora, asi kuramba kwayo solder kwakashata!
4 nguva: SHONA (3)-ImAg (4.3)-OSP (10)-ImSn (10).
(3) Kunyorova kuSAC305 (mushure mekupfuura nemuchoto kaviri).
SHONA (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
Muchokwadi, maAmateurs anogona kunge akavhiringika zvakanyanya neaya ehunyanzvi paramita, asi zvinofanirwa kucherechedzwa nevagadziri vePCB proofing uye chigamba.
Nguva yekutumira: May-28-2021
