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Iko kukanganisa kwePCB pamusoro pekurapa tekinoroji pane welding mhando

PCB pamusoro kurapwa ndiyo kiyi uye hwaro hweSMT chigamba mhando.Nzira yekurapa yekubatanidza iyi inonyanya kusanganisira pfungwa dzinotevera.Nhasi, ini ndichagovera chiitiko muhunyanzvi wedunhu bhodhi proofing newe:
(1) Kunze kweENG, ukobvu hweiyo plating layer haina kunyatso kutsanangurwa mune yakakodzera nyika zviyero zvePC.Inongodiwa chete kusangana nezvinodiwa solderability.Izvo zvinodikanwa zveindasitiri ndezvizvi.
OSP: 0.15 ~ 0.5 μm, isina kutaurwa neIPC.Inokurudzirwa kushandisa 0.3 ~ 0.4um
EING: Ni-3~5um;Au-0.05~0.20um (PC inongotaura zvazvino zvakatetepa zvinodiwa)
Im-Ag: 0.05 ~ 0.20um, iyo yakakora, iyo yakanyanya kuomarara iyo corrosion iri (PC haina kutaurwa)
Im-Sn: ≥0.08um.Chikonzero chekukora ndechekuti Sn neCu zvicharamba zvichikura kuita CuSn pakamuri tembiricha, izvo zvinokanganisa solderability.
HASL Sn63Pb37 inowanzo umbwa pakati pe1 ne25um.Zvakaoma kunyatso kudzora maitiro.Lead-isina inonyanya kushandisa SnCu alloy.Nekuda kweiyo yakanyanya kupisa tembiricha, zviri nyore kuumba Cu3Sn isina ruzha solderability, uye haisati yave kushandiswa parizvino.

(2) Kunyorova kuSAC387 (maererano nenguva yekunyorova pasi penguva dzakasiyana dzekupisa, unit: s).
0 nguva: im-sn (2) florida kuchembera (1.2), osp (1.2) im-ag (3).
Zweiter PLENAR CHIKAMU Zweiter PLENAR CHIKAMU Im-Sn ine yakanyanya kunaka kusaita ngura, asi kuramba kwayo solder ishoma!
4 nguva: SHONA (3)-ImAg (4.3)-OSP (10)-ImSn (10).

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(3) Kunyorova kuSAC305 (mushure mekupfuura nemuchoto kaviri).
SHONA (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
Muchokwadi, maAmateurs anogona kunge akavhiringika zvakanyanya neaya ehunyanzvi paramita, asi zvinofanirwa kucherechedzwa nevagadziri vePCB proofing uye chigamba.


Nguva yekutumira: May-28-2021